Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof

ABSTRACT

A phase-separated evaporator includes a boiler plate and a phase separation chamber that includes a housing, connected to the boiler plate, having a gas port and a liquid port; and a phase partitioner connected to interiors of the housing, dividing the phase-separated evaporator into a vapor directing compartment and a condensate directing compartment. The phase partitioner includes a partition panel and multiple feeding injectors extending from the partition panel, with the injector tips disposed immediately above the boiler plate. The returning condensate from a condenser enters from the liquid port into the condensate directing compartment and feeds onto the boiler plate through the feeding injectors; while the vapor generated in the vapor directing compartment exits from the gas port, without encountering the condensate. Further disclosed are a high efficiency heat dissipation system utilizing the phase-separated evaporator and a blade-thru condenser, and a computer system utilizing the heat dissipation system.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.11/800,248, filed on May 5, 2007, which claims the benefit under 35 USC119(e) of the provisional patent application Ser. No. 60/797,848, filedMay 6, 2006, and is a continuation-in-part of U.S. patent applicationSer. No. 11/494,238, filed on Jul. 27, 2006, which claims the benefitunder 35 USC 119(e) of provisional patent application Ser. No.60/703,945, filed Jul. 30, 2005, and provisional patent application Ser.No. 60/797,848, filed May 6, 2006. All parent patent applications areherein incorporated by reference in their entirety.

FIELD OF THE INVENTION

The present invention relates to an evaporator and a heat dissipationsystem utilizing the evaporator. More specifically, the evaporatorincludes phase-partitioner which separates the vapor and the condensateinto two compartments. The present invention further relates to a highefficiency heat dissipation system utilizing the phase-separatedevaporator and a blade-thru condenser.

BACKGROUND OF THE INVENTION

With the never-ending increase of computing power, effectively cooling aCPU has become a technical challenge. The present temperature limit fora CPU is approximately 60° C. As the power of a CPU increases, more heatis generated; therefore, the CPU requires a higher efficiency andcapacity of the heat dissipation device in order to provide an effectivethermal management to the computer system. Heat dissipation can beachieved by moving the heat generated primarily at the CPU and othercomponents such as the memory controller, memory chips, graphicsprocessor or power chips, to a location where it can be safelydischarged to the ambient air.

One type conventional heat dissipation device is passive metal heatsinks. The heat sinks are typically made of thermally conductive metalblocks that can be attached to the cover plate of a CPU for dissipatingheat. The block can be fabricated to include plurality of thin fins toincrease the surface area for heat dissipation. The heat sinks are onlyeffective to dissipate heat generated up to about 90 watts. Another typeof conventional heat dissipation device is heat pipes, which are onlyeffective to dissipate heat generated up to about 130 watts. Therefore,the conventional heat dissipation devices have very limited capacitiesand are inadequate for cooling the high power CPU, which operates with apower of about 235 watts or higher.

At this time the computer industry in general believes that liquidcooling is the only viable solution for the immediate future. Recently,major computer manufacturers have started to release high powercomputers using liquid cooling devices for thermal management. Forexample, Dell's new top line system XPC 700 includes a refrigeratedliquid cooling system. IBM has released its Power 6 Plus chip at 5.2GHz, which operates with a power in a range of 300 to 425 watts and isexpected to be supported with liquid cooling devices. However, liquidcooling devices are expensive, noisy and difficult to maintain.

In heat dissipation devices based on the phase exchange of a coolantbetween the liquid and gas phases, the efficiency of the heatdissipation devices depends on both the evaporator and the condenser.Traditional evaporators only have one chamber or compartment above theboiler plate. When the generated vapor exits the evaporator, itencounters the returning condensate, this causes a prematurecondensation of the vapor before it exits from the evaporator. On theother hand, prior to the condensate reaches the boiler plate, thecondensate is already heated up by the vapor. As such, the efficiency ofthe evaporator is compromised.

Based on the above, it is apparent that a strong need exists in thecomputer industry for improved heat dissipation devices that have higherefficiency and capacity for thermal management of computer systems.Furthermore, there is also a strong need for improved heat dissipationdevices in other industries, such as automobile and air conditioning.

SUMMARY OF THE INVENTION

In one aspect, the present invention is directed to a phase-separatedevaporator. In one embodiment, the phase-separated evaporator comprisesa boiler plate and a phase separation chamber that comprises a housinghaving a base connected to the boiler plate; the housing having a liquidport and a gas port; and a phase partitioner connected to interiors ofthe housing, dividing the phase-separated evaporator into a condensatedirecting compartment and a vapor directing compartment. The condensatedirecting compartment is in communication with the liquid port, and thevapor directing compartment is in communication with the gas port. Thephase partitioner includes a partition panel and a plurality of feedinginjectors extending from the partition panel toward the boiler plate.

In a further aspect, the present invention is directed to a heatdissipation system utilizing the instant phase-separated evaporator. Theheat dissipation system comprises a phase-separated evaporator asdescribed above, a condenser, a vapor conduit connected between the gasport of the evaporator and an input interface of the condenser, and acondensate conduit connected between an output interface of thecondenser and the liquid port of the evaporator. The heat dissipationsystem further comprises a fan positioned adjacent to the condenser, forremoving hot air released from the condenser.

In one embodiment, the condenser is a blade-thru condenser. In aspecific embodiment, the blade-thru condenser comprises a condensercore, an input interface, and an output interface. The condenser corecomprises multiple substantially planar blades, each of the multipleblades having at least one chamber formed monolithically therein, and afloor of the chamber having at least one aperture. The multiple bladesare joined in parallel alignment, with the apertures positioned topermit vapor and condensate to pass through the apertures. The aperturesinclude at least one reed.

In a further embodiment, the blade-thru condenser comprises a condensercore that comprises multiple substantially planar blades joined inparallel by one or more spacer rings disposed between two adjacentblades. Each of the blades comprises one or more chambers formed withininteriors of the spacer rings, and a floor of the chamber has at leastone aperture. The chambers of the multiple blades are in alignment topermit vapor and condensate to pass through the apertures.

In another aspect, the present invention is directed to a computersystem that comprises a housing, a motherboard comprising a centralprocessing unit (CPU) and input, output interfaces, a fan disposedwithin the housing, and a heat dissipation system comprising the instantphase-separated evaporator with the boiler plate in a direct contactwith a heat generating component of the computer and the condenser asdescribed above. The heat generating component includes the CPU, memorycontroller, memory chip, graphics processor, or power chip.

The advantages of the present invention will become apparent from thefollowing description taken in conjunction with the accompanyingdrawings showing the exemplary embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective exterior view of the phase-separated evaporatorof one embodiment of the present invention.

FIG. 2 is a top view of the phase-separated evaporator shown in FIG. 1.

FIG. 3 is a cross-sectional view of the phase-separated evaporator ofFIG. 1, along line A-A of FIG. 2.

FIG. 4 is a perspective cut-out view of the phase-separated evaporatorof FIG. 1, along line A-A of FIG. 2.

FIG. 5 is a see-through image view of the phase-separated evaporatorshown in FIGS. 1 and 4.

FIGS. 6 and 6A are top and side views of the phase partitioner of thephase-separated evaporator shown in FIG. 3.

FIG. 6B is a cut-out view of the phase partitioner along line A-A ofFIG. 6.

FIG. 7 is a bottom perspective view of the phase partitioner of thephase-separated evaporator shown in FIG. 3.

FIG. 8 is a top view of the boiler plate of the phase-separatedevaporator shown in FIG. 3, showing the locations of the landing zones.

FIG. 9 is a perspective view of a heat dissipation system of oneembodiment of the present invention.

FIG. 10 is a cross-sectional view showing the phase-separated evaporatorof FIG. 3 positioned with a 90 degree rotation.

FIG. 11 is a cross-sectional view of the phase-separated evaporator of afurther embodiment of the present invention.

FIG. 12 is a top view of the condenser core of the blade-thru condenserof one embodiment of the present invention.

FIG. 13 is a partial enlarged side view of the condenser core along lineA-A of FIG. 12.

FIG. 13A is a magnified side view of a solder joint between two bladesof the condenser core shown in FIG. 13.

FIG. 13B is magnified cross-sectional view of a reed of the condensercore shown in FIG. 13.

FIG. 14 is a top view of the input manifold of the blade-thru condenserof FIG. 9.

FIG. 14A is a cross-sectional view of the input manifold of theblade-thru condenser along line C-C of FIG. 9.

FIG. 14B is a cross-sectional view of the input manifold of theblade-thru condenser along line D-D of FIG. 14A.

FIG. 15 is a top view of the output manifold of the blade-thru condenserof FIG. 9.

FIG. 15A is a cross-sectional view of the output manifold along line A-Aof FIG. 15.

FIG. 16 is a top view of the condenser core of the blade-thru condenserof a further embodiment of the present invention.

FIG. 16A is a perspective view of a spacer ring of the condenser core ofFIG. 16.

FIG. 16B is an enlarged top view of the aperture on the floor of thecondensation chamber on a blade of the condenser core shown in FIG. 16.

FIG. 17 is a side view of a blade-thru condenser of one embodiment ofthe present invention.

FIG. 18 is the test power circuit used in the Example.

FIGS. 19A and 19B are the test results of the performance of an existingheat pipe.

FIGS. 20A and 20B are the test results of the performance of the heatdissipation system of the present invention.

It is noted that in the drawings like numerals refer to like components.

DETAILED DESCRIPTION OF THE INVENTION

In one aspect, the present invention provides a phase-separatedevaporator for enhancing the efficiency of an evaporator in liquid-gasphase exchange process and the efficiency of heat dissipation.

Referring to FIGS. 1 to 5, in one embodiment, phase-separated evaporator10 comprises a boiler plate 20 and a phase separation chamber 40, asshown in FIGS. 3 and 4.

In the embodiment shown, boiler plate 20 has an upper surface 22, abottom surface 24, and a plurality of pins 30 extending upward fromupper surface 22. Preferably, upper surface 22 and pins 30 are coatedwith a micro porous coating material. Boiler plate 20 is made of a heatconductive material, preferably metal, for example, copper. For use withan existing CPU, a boiler plate can have a square shape with a dimensionof about 40 cm (centimeter) by about 40 cm. The micro porous coatingmaterial coated area is about 30 cm by about 30 cm. In one embodiment,pins 30 have a square cross section, with a dimension of about 1 mm(millimeter) by 1 mm and a height about 4 mm. However, pins 30 can alsohave other geometries, such as rectangular, circular, or oval in thecross section. Furthermore, a boiler plate coated with the micro porouscoating material, without pins, can also be used in the evaporator ofthe present invention.

Phase separation chamber 40 comprises a housing 50 and a phasepartitioner 80. Housing 50 includes side walls 52, 54, 55 a and 55 b, atop wall 70 and a base 60 connected to periphery 26 of boiler plate 20.The top wall 70 inclines, from the first side wall 52 to the second sidewall 54 along longitudinal axis 2, toward boiler plate 20. As shown inFIG. 3, the first side wall 52 extends beyond boiler plate 20 in thelongitudinal direction, hence, phase separation chamber 40 has alongitudinally extended section 42, which provides an additional spacefor expansion of the vapor. Housing 50 has a gas port 56 and a liquidport 58 positioned on first side wall 52. In the configuration shown,base 60 has two anchoring flanges, 62 and 64, each having an aperture 66for fastening the evaporator to the device which needs heat dissipation.

Housing 50 is made of a thermal-insulating material, which minimizes theconductive heat transfer from boiler plate 20 to housing 50, in turn,minimizes the conductive heat transfer from the evaporator to theconnection conduits and the condenser used in a heat dissipation system.In this sense, housing 50 is also referred to as a decoupling chamber,as it thermally decouples the evaporator from the condenser. The termsdecoupling and decouple used herein refer to the effect of inhibitingthe conductive heat transfer from the base of the evaporator which canbe in a direct contact with the heat source, such as the CPU of acomputer, through the walls of the housing of the evaporator, to thecondenser.

Furthermore, housing 50 insulates the heat inside the evaporator fromthe environment, which maximizes the heat carried out by the vapor.Suitable thermal-insulating materials include, but are not limited to,ceramic, thermoplastic, for example, epoxy plastic, diallyl phthalate,diallyl isophthalate, and phenolic resin. Preferably, housing 50 has anintegral single piece structure, which can be produced by injectionplastic molding.

In the embodiment shown, phase partitioner 80 includes a partition panel82 and a plurality of feeding injectors 90 extending from lower surface86 of partition panel 82 toward upper surface 22 of boiler plate 20. Theperiphery of phase partitioner 80 is hermetically connected to theinteriors of the side walls of housing 50, which divides phase-separatedevaporator 10 into a vapor directing compartment 6 and a condensatedirecting compartment 8. Partition panel 82 also inclines from the firstside wall 52 to the second side wall 54 along longitudinal axis 2,toward boiler plate 20, and is substantially in parallel with, andadjacent to, top wall 70 of housing 50. To facilitate the positioning ofpartition panel 82 within housing 50, housing 50 can have a bossingaround the interior of the side walls, so that partition panel 82 can beconveniently disposed against the bossing.

As shown in FIGS. 3 thru 5, partition panel 82 separates gas port 56 andliquid port 58 into two compartments. Gas port 56 is in communicationonly with vapor directing compartment 6 and liquid port 58 is incommunication only with condensate directing compartment 8. As shown inFIGS. 6 and 7, partition panel 82 further includes an opening 89functioning as a pressure vent for balancing the pressure between vapordirecting compartment 6 and condensate directing compartment 8.Preferably, opening 89 is positioned above the longitudinally extendedsection 42 beyond the nucleated boiling surface on which the evaporationof the coolant occurs, as described hereinafter.

Referring to FIGS. 6 thru 7 and 3, each feeding injector 90 has aninjector inlet 92 communicating with upper surface 84 of partition panel82 and an opposing injector tip 94. In the embodiment shown, feedinginjector 90 tapers toward injector tip 94, with injector tip 94 disposedimmediately above upper surface 22 of boiler plate 20. However, itshould be understood that feeding injectors without tapering can also beused.

In one embodiment shown in FIG. 8, boiler plate 20 has a plurality oflanding zones 28 on upper surface 22 among pins 30. In the embodimentshown, a landing zone 28 is located at a regular position of a pinwithin the array of pins 30, yet with a pin removed or not present atsuch a location. Feeding injectors 90 are disposed immediately abovelanding zones 28. With this configuration, there is a sufficient spacefor each injector tip 94 among pins 30, which ensures no physicalcontact between feeding injector 90 and adjacent pins 30. The surfacesof landing zones 28 are substantially free of micro porous coatingmaterial, and hence it reduces bubble formation at these locations, andprovides effective receiving areas for the condensate.

Phase partitioner 80, inclusive feeding injectors 90, is made of athermal-insulating material, which minimizes the conductive heattransfer through partition panel 82 between vapor directing compartment6 and condensate directing compartment 8. Suitable thermal-insulatingmaterials include those described above for housing 50.

In a further aspect, the present invention provides a heat dissipationsystem 100, which comprises phase-separated evaporator 10 of the presentinvention described above, a blade-thru condenser 200, and conduitsconnecting between the evaporator and the condenser, as shown in FIG. 9.The system includes a fan 500 positioned next to the condenser, whichblows ambient air through the blades to remove the heat released fromthe condenser. Preferably, the condenser is a blade-thru condenser asdescribed hereinafter. A blade-thru condenser has been described indetail in co-pending U.S. patent application Ser. No. 11/494,238, whichis hereby incorporated by reference in its entirety.

However, the condenser can also be a conventional tube-and-bladecondenser. It should be understood that the operational mechanism of thephase-separated evaporator of the present invention is independent ofthe structure of the condenser, although the performance of the heatdissipation system can be affected by the structure and cooling capacityof a specific condenser.

The heat dissipation system 100 further comprises an aqueous coolant.Suitable coolants include, but are not limited to, deionized water andrefrigerant, such as refrigerant HFE7000 manufactured by 3M andGenetron® refrigerant 245FA manufactured by Honeywell.

Preferably, two separate conduits, a vapor conduit 120 and a condensateconduit 130 are used to connect phase-separated evaporator 10 andcondenser 200. The first end 122 of vapor conduit 120 is connected togas port 56 of phase separation chamber 40, the second end 124 of vaporconduit 120 is connected to an input interface of condenser 200. Thefirst end 132 of condensate conduit 130 is connected to an outputinterface of condenser 200 and the second end 134 of condensate conduit130 is connected to liquid port 58 of phase separation chamber 40. Inthe embodiment shown, vapor conduit 120 has a larger diameter fordelivering gas.

Preferably, conduits 120 and 130 are made of flexible material, such ascorrugated stainless steel tubing, copper alloy tubing, or othersuitable materials, which provides the flexibility of positioning thecondenser. Furthermore, the material used for the conduits isimpermeable to the refrigerant, and is a poor heat conducting material.Corrugated stainless steel tubing possesses these preferred properties.Moreover, both conduits can be further thermally insulated from theambient environment to reduce heat transfer between the conduits and theenvironment.

The operation of phase-separated evaporator 10 is described hereinafterin reference to a system environment. Referring now to FIGS. 3, 4 and 5,in operation a predetermined amount of an aqueous coolant, for exampledeionized water comprising a surface active agent, is placed intophase-separated evaporator 10 and the heat dissipation system is sealedunder the vacuum. Phase-separated evaporator 10 is placed on a heatgenerating device that needs heat dissipation, with bottom surface 24 ofboiler plate 20 in direct contact with a contact surface of the device,for example, placing bottom surface 24 of boiler plate 20 on top of thedie face of a central processing unit (CPU) of a computer.

As the heat is transferred conductively through boiler plate 20, thecoolant absorbs the heat and evaporates. This process occurs on top ofthe micro porous coating material coated on the upper surface 22 andpins 30, which is known as the nucleated boiling process, hence, thecoated surface is herein also referred to as the nucleated boilingsurface. The vapor generated inside vapor directing compartment 6 exitsfrom gas port 56, and enters into condenser 200 through vapor conduit120. The vapor releases heat inside condenser 200, and is condensed intothe liquid form inside the condenser. Then, the condensate returns backto phase-separated evaporator 10 through condensate conduit 130. Thecondensate enters from liquid port 58 into condensate directingcompartment 8, therein it flows down on the inclined partition panel 82.The condensate enters feeding injectors 90, as driven by gravity, andinjects from injector tips 94 onto landing zones 28 on boiler plate 20.From the landing zones, the condensate diffuses on the nucleated boilingsurface by a capillary effect of the micro porous coating material, andthereon absorbs heat and evaporates again. As such, the evaporation andcondensation processes repeatedly continue within the heat dissipationsystem, which effectively remove heat from the heat generating device toa surrounding environment.

With regard to the feeding of the condensate from injector tips 94 tolanding zones, in addition to the gravity drive, it is believed thatthere may be a localized differential pressure at the landing zones,which may further facilitate feeding of the condensate. In the processof nucleated boiling, when a bubble leaves the pin immediately adjacentto a landing zone, a localized vacuum is formed as the condensate rushesin to replace the space of the bubble. This continuous liquid to gasconversion and liquid replacement may cause a localized differentialpressure around the landing zone, which may have an inductive effect tothe feeding of condensate from an injector tip.

As described above, phase-separated evaporator 10 of the presentinvention separates vapor and condensate into two compartments withinthe evaporator. This profoundly enhances the efficiency of theevaporator. In the phase-separated evaporator, when the vapor exits fromthe evaporator, it is guided by vapor directing compartment 6, withoutany physical contact with the returning condensate; therefore, the vaporremains at its high temperature and effectively carries heat into thecondenser. Furthermore, by separating the condensate from the vapor, theexit of the vapor is not impeded by the counter flow turbulence causedby the returning condensate. On the other hand, as the condensate entersthe evaporator, it is guided by condensate directing compartment 8,without any physical contact with the rising vapor; therefore, thecondensate remains at its low temperature when it is injected onto theboiler plate. Consequently, the phase-separated evaporator of thepresent invention generates higher temperature vapor as it leaves theevaporator and maintains lower temperature condensate as it reaches theboiler plate in comparison to the traditional evaporator. In otherwords, the phase-separated evaporator maximizes the temperaturedifference (ΔT) between the out-bound vapor and the in-bound condensate.It can be understood that the lower the temperature of the condensateis, the faster the conductive heat transfers from the boiler plate tothe condensate, and more heat is absorbed in the process of evaporation.

As well known in traditional evaporators, which only have one chamber orcompartment above the boiler plate, the rising vapor encounters thereturning condensate, and premature condensation of the vapor occursbefore it exits from the evaporator. On the other hand, prior to thecondensate reaches the boiler plate, the condensate is already heated upby the vapor. Herein, the term “premature condensation” refers tocondensation of the vapor prior to the vapor entering into thecondenser. It can be appreciated that using the phase-separatedevaporator of the present invention, without physical contact with thein-bound condensate, the premature condensation of the out-bound vaporwithin the evaporator is minimized. This maximizes the amount of heatcarried by the vapor out of the evaporator.

Furthermore, the space between top wall 70 and partition panel 82 isvery limited, and the condensate does not accumulate within this space.Hence, the condensate has very short retention time within condensatedirecting compartment 8 before being delivered to boiler plate 20. Thisreduces heating of the condensate by conductive heat transfer.

To further minimize the retention time of the condensate in condensatedirecting compartment 8, partition panel 82 can further include severalcondensate grooves (not shown) on upper surface 84, connecting inlets 92of feeding injectors 90 in the longitudinal direction. The condensategrooves can start immediately next to liquid port 58, and end at thelower edge of the inlet 92 of the feeding injector 90 nearest to thesecond side wall 54. The condensate grooves further guide the condensateinto feeding injectors 90, and minimize the retention of condensate inthe area around inlets 92. It should be understood that other suitableconfigurations or arrangement to facilitate the delivery of condensateinto the feeding injectors can also be used for the purpose of thepresent invention.

To facilitate efficient delivery of the condensate to the boiler plate,injector tip 94 can have a meniscus cross section. Because of theminimum distance between injector tip 94 and upper surface 22 of boilerplate 20, for example 0.25 mm, the meniscus shape eases the flow of thecondensate, and also minimizes disruption of the flow from the bubblesgenerated by the nucleated boiling.

As shown in FIG. 10, the phase-separated evaporator shown in FIGS. 1-5can also be used with boiler plate 20 in a vertical orientation. Withcertain computer configurations, the contact surface of the CPU is in avertical position, which requires a vertical interface with the heatdissipation device. As shown in FIG. 10, the functions ofphase-separated evaporator 10 are maintained in this orientation. Thecondensate flows down along the top wall 70 of housing 50 and injectsonto boiler plate 20 in a horizontal direction as guided by feedinginjectors 90.

In a further embodiment, feeding injectors 90 of partition panel 82 mayhave different inner diameters, depending on the locations of thefeeding injectors. For example, for the vertical orientation of thephase-separated evaporator, the feeding injectors in a higher position,or more adjacent to the first side wall 52, have a larger innerdiameter; and the inner diameter of the feeding injectors reducesgradually in a downward direction, or more closed to the second sidewall 54. Such a gradual reduction of the inner diameter of the feedinginjectors assists in controlling the condensate flow when it isdelivered to upper surface 22 of boiler plate 20 to obtain more evendistribution of the condensate.

Depending on the arrangement between the phase-separated evaporator andthe condenser of the heat dissipation system, the phase-separatedevaporator can be configured differently. In an alternative embodiment,a phase-separated evaporator 10A is provided as shown in FIG. 11. Inthis configuration, top wall 70 a of housing 50 a has two sections, aninclined section 72, which covers substantially upper surface 22 ofboiler plate 20 along longitudinal axis 2 a, and a port section 74,which is next to, and vertically extending above, inclined section 72.The port section 74 has a connection wall 76 on one side, which connectswith inclined section 72. On the other side, the first side wall 52 a ofhousing 50 a extends into the portion section 74, which is substantiallyin parallel with connection wall 76, forming a chimney-like structure.Liquid port 58 a and gas port 56 a are positioned on top of port section74 of top wall 70 a. To provide phase separation within phase separationchamber 40 a, partition panel 82 a includes an inclined panel 81substantially in parallel with inclined section 72 of top wall 70 a anda vertical section 83 extending from inclined panel 81 upwardly betweenconnection wall 76 and first side wall 52 a. The structure andorientation of feeding injectors 90 are the same as described above inthe phase separation chamber 40. The opening 89 a, or pressure vent, ispositioned on vertical section 83 of partition panel 82 a betweencondensate directing compartment and the vapor directing compartment.With this configuration, liquid port 58 a and gas port 56 a, positionedon top wall 70 a, can be connected to the condenser by the vapor andcondensate conduits, or can directly interface with the inlet and theoutlet of a condenser disposed above port section 74.

Furthermore, the phase-separated evaporator 10A can also be orientatedwith boiler plate 20 in the vertical position, in the same manner shownin FIG. 10 of the evaporator 10. In this orientation, the section of thecondensate directing compartment between connection wall 76 and verticalsection 83 of partition panel 82 a can also function as a condensatereservoir.

The phase-separated evaporator of the present invention has made arevolutionary breakthrough in the structure of an evaporator. It hasabandoned the conventional single chamber structure, and for the firsttime, introduces phase separation within the evaporator to direct thereturned condensate directly onto the boiler plate without encounteringthe exiting vapor. The efficiency enhancement achieved by the instantphase-separated evaporator contributes to the record-breaking heatdissipation efficiency of the heat dissipation system of the presentinvention as illustrated hereinafter in the example.

As stated above, in a preferred embodiment the heat dissipation systemof the present invention includes a blade-thru condenser. The structureand operation mechanism of the blade-thru condenser are describedhereinafter.

Referring now to FIGS. 9, 12 and 13 thru 13B, in one embodimentblade-thru condenser 200 comprises a condenser core 220, a vapor inputinterface in the form of input manifold 300, and a condensate outputinterface in the form of output manifold 400.

Condenser core 220 comprises a plurality of layers of blades 230 joinedone on top of another along a longitudinal axis 212 of condenser 200 byjoint interfaces 240 formed between two adjacent blades. Each layer ofblades 230 has multiple chambers 250, herein also referred to ascondensation chambers. In the embodiment shown, condensation chambers250 are drawn chambers, which are formed monolithically in each blade.On floor 252 of each condensation chamber 250 there can be one or moreapertures, or openings, 260, which permit vapor and condensate to passtherethrough and cause vibration of floor 252 of condensation chamber250. As shown, a plurality of layers of blades 230 are so aligned thatfloors 252 of condensation chambers 250 of each layer of blade 230 areon top of walls 256 of condensation chambers 250 of blade 230immediately underneath, thereby forming multiple phase exchange columns280 in parallel to longitudinal axis 212. In the embodiment shown, eachblade 230 of condenser core 220 includes three condensation chambers.However, the number of condensation chambers can vary depending on thedesired capacity and/or size of the condenser. For example, in a lowcapacity condenser, each blade can have only one or two condenserchambers, and the condenser core has only one or two phase exchangecolumns.

Blades 230 are made of heat conducting materials, preferably metal, suchas copper or aluminum. In an exemplary embodiment, blade 230 is made ofa copper blank. As shown, blades 230 are substantially planar except theareas having the drawn chambers. Between each two adjacent blades 230,there is a sufficient distance for dissipating heat released from theblades by convection driven by ambient air flow. In the exemplaryembodiment described above, the distance between two adjacent blades isabout 1.5 mm.

To construct condenser core 220, multiple drawn chambers 250 (three areshown in FIG. 12) are formed monolithically in each blade 230. Twoapertures, 270 and 274, are fabricated on floor 252 of each drawnchamber 250. The cross sectional profile of a lower portion of wall 256of each drawn chamber 250 is configured to interlock with a top portion254 of the wall of drawn chamber 250 of the immediately underlyingblade. FIG. 13A shows detailed structure of a joint interface 240between two immediately adjacent blades 230 of one embodiment of thepresent invention, which can be jointed together by soldering, adhesive,or other suitable means. As shown, top portion 254 of wall 256 is asmall planar recess, which provides a seating rim to the condensationchamber 250 of the blade immediately above.

It should be understood that in a preferred embodiment each blade 230has a monolithic structure. Each drawn chamber 250 is an integral partof blade 230, and there is no interface of different materials betweendrawn chamber 250 and the rest of blade 230. This monolithic structureeliminates the metal to metal interfaces between a tubular core andseparate fins affixed thereto by soldering or brazing, which are theinterface structures used in most conventional condensers, radiators andheat exchangers. These metal to metal interfaces have intrinsically asignificant thermal resistance, and therefore, seriously hinder the heattransfer from the tubular core to the fins.

Therefore, it can be understood that the term “blade-thru” used hereinrefers to a structural feature wherein a monolithic blade forms part ofthe chamber where the phase exchange of vapor occurs, and the exteriorfin. In the condenser so structured, along each layer of blade there isno interface between different materials at the transition point betweenthe fin and the condensation chamber which, in function, corresponds topart of the conventional tubular core. Therefore, there is no hindranceto heat transfer from the floor of the condensation chamber to the fin.

In one exemplary embodiment as shown in FIGS. 12 thru 13B, condensercore 220 comprises about 40 planar blades 230, interconnected togetheras described above. In the embodiment shown, condensation chamber 250has a circular shape with a diameter about 12 mm. In this structure,apertures 260 include an orifice 270 on one side of floor 252, and asemispherical aperture 274 on the other side of floor 252. Thesemispherical aperture 274 can be produced by partial piercing, whichforms a reed flap 272. It noted that reed flap 272 is part ofsemispherical aperture 274, and in the context herein when the term ofsemispherical aperture 274 is used it refers to the aperture inclusiveof the reed flap. In the structure shown, orifice 270 is circular. Inone embodiment, orifice 270 has a diameter of 3 mm and semisphericalaperture 274 has a height about 0.4 mm at the center of the aperture.However, orifice 270 can also have other shapes or geometries, such aselliptical, square, rectangular, triangle, elongated slot, etc.Similarly, semispherical aperture 274 can also have various other shapesand geometries; for example, an alternative aperture having a reed canbe produced by a knife edge formed by a narrow slot cut, or other suchcuts that produce a reed which can vibrate in a passage of vapor flow.Furthermore, the reed flap can have a different thickness between theedge portion and root portion that is adjacent to the wall of thechamber, and typically, the edge portion is thinner. In operation, thethinner the edge portion is, the lower the vapor pressure that triggersthe vibration. Moreover, the temper, or hardness, of the metal alsocontributes to the triggering threshold of the vibration and thefrequency of the vibration.

In the working environment of the blade-thru condenser of the presentinvention, orifice 270 and semispherical aperture 274 are vibratoryopenings, which vibrate when vapor passes through the apertures. In thehermetically sealed condenser 200, which is connected to evaporator 10by conduits, as vapor enters a phase exchange column from the upper endof the condenser core, it travels down the column by passing throughorifice 270 and semispherical aperture 274 in every condensationchamber. The vapor flow, more specifically, the pressure differencebetween the upper and lower sides of the floor of the condensationchamber, induces vibration of the floor.

Between orifice 270 and semispherical aperture 274, the vibration ofsemispherical aperture 274 can be initiated at a lower vapor pressure,or a lower pressure difference between the upper and lower sides of thefloor. This can be appreciated by the fact that a much lower pressuredifference, which is also referred to as differential pressure, cancause vibration of reed flap 272, hence, induce the vibration of thefloor. The vibrations of orifice 270 and semispherical aperture 274 areboth in multiple frequencies, yet can be in different frequency ranges.When both orifice 270 and semispherical aperture 274 are present on thefloor of condensation chamber 250, as shown in FIGS. 12 and 13, thevibration can be initiated by different vapor pressures, or pressuredifferences, and the vibration frequencies also have a broader spectrum.This results in an enhancement of heat exchange efficiency of thecondenser, as further described hereinafter. Moreover, it can beappreciated that the vibration of the condensation chambers might causethe vapor to pass the apertures in an oscillatory manner, which in turn,could further enhance the vibration of the floors. It should beunderstood that combinations of other suitable aperture structures orconfigurations can also be used to achieve the same effect.

Therefore, the term of vibratory opening or aperture used herein refersto one or more apertures on a thin blade, which vibrates when exposed toa passage of vapor flow or a differential pressure. This is similar tothe working mechanism of a Helmholtz resonator.

Further details of the structure and operation of condenser 220 aredescribed hereinafter in reference of FIGS. 12 and 13. As shown, withinone phase exchange column 280, the first blade 230 from the upper end ofcondenser core 220 has its orifice 270 aligned near semisphericalaperture 274 of the second blade 230, and its semispherical aperture 274aligned near orifice 270 of the second blade 230. In this sense,orifices 270 and semispherical apertures 274 of two immediately adjacentblades 230 are misaligned. However, orifices 270 and semisphericalapertures 274 of every alternate layer of blades are in alignment,therefore, the positioning of orifices 270 and semispherical apertures274 is bilaterally symmetric.

As vapor enters each phase exchange column from input manifold 300, itpasses through orifices 270 and semispherical apertures 274 forming avapor column, which causes vibration of floor 252 of each condensationchamber 250. Furthermore, as can be visualized in FIG. 13, with thebilaterally symmetric arrangement within each phase exchange column 280,the vapor travels down with a zig-zag pathway through orifices 270 andsemispherical apertures 274, which forces the vapor to have a maximumcontact with the metal surface, and hence to achieve a maximum heatexchange between the vapor and the metal. On the other hand, the angleof reed flap 272 also facilitates the condensate to flow down throughsemispherical apertures 274 within the column. It should be understood,however, that the bilaterally symmetric arrangement is only one ofpossible arrangement of the vibratory apertures, and various otherstructures and arrangements of the vibratory apertures can be used forthe purpose of the present invention.

In the process of continuous heat exchange inside the condenser, thecondensate formed in each condensation chamber flows down within columns280. The vibration of the chamber floor reduces retention of thecondensate within the condenser chamber. Furthermore, it is known thatthe liquid film temporarily formed by the condensate on the metalsurface insulates the metal from a direct contact with the vapor, whichslows down the rate of heat exchange between the vapor and the metal,therefore, could reduce the heat exchange efficiency of the condenser.With the structure and the operation mechanism of condenser core 220 ofthe present invention, this film effect has been substantially reducedby the vibration of the floor induced by the vibratory apertures in eachcondensation chamber, as described above. The vibration reduces theliquid film formation and retention on the surface of condenser chamber,and hence, reduces the loss of heat exchange efficiency caused by thisfilm.

Moreover, it can be further appreciated when the metal vibrates withinthe flow of the vapor, the effective surface contact between the highertemperature vapor to the lower temperature metal is maximized.Therefore, vibration of the metal increases the heat transfer from thevapor to the metal beyond the heat transfer that occurs in a staticenvironment, because of the increased effective surface contact betweenthe metal and the surrounding column of vapor.

As described above, the condenser core of the present invention utilizesthe monolithic and integral blade-thru structure and preferablyvibratory effect to substantially enhance heat exchange efficiency, itis hence, also referred to as a blade-thru Helmholtz condenser.

Fan 500 is positioned adjacent to condenser core 220, which blows airthrough condenser core 220 in a direction transverse to the longitudinalaxis 212 of condenser core 220, to dissipate heat released insidecondenser core 220 into the surrounding environment.

As shown in FIGS. 9 and 14 thru 14B, in one embodiment input manifold300 is in a form of a chamber, having a case 310 and a base 320. Case310 has a vapor inlet 312 to which the second end 124 of vapor conduit120 is connected. There are multiple vapor outlets 330 a, 330 b and 330c on base 320. As shown in FIG. 9, input manifold 300 is disposed on topof condenser core 220, wherein each vapor outlet is positioned directlyabove a condensation chamber 250 on the first blade 230 of condensercore 220, for directing vapor into one column of condensation chambers250 within condenser core 220. As shown in FIGS. 14A and 14B, vaporoutlets 330 a, 330 b and 330 c have different diameters. The diameter ofthe vapor outlet increases with the distance of the outlet from vaporinlet 312, which compensates the pressure difference due to the distancefrom vapor inlet 312, and balances the amount of vapor entering into thethree columns of condensation chambers 250.

As shown in FIGS. 15 and 15A, output manifold 400 has a similar, yetreversed structure of the input manifold 300, wherein case 410 faces upand the lowest blade 230 is disposed on a top panel 420. Output manifold400 has multiple condensate inlets 430 on top panel 420. Each condensateinlet 430 is positioned directly underneath one condensation chamber 250of the lowest blade 230 of condenser core 220. As shown in FIG. 15, aspacer ring 580 is positioned on the top panel 420 around eachcondensate inlet 430. Different from the vapor inlets of the inputmanifold, condensate inlets 430 can have the same diameter, because atthis location the vapor has completely condensed and no pressuredifference needs to be compensated. Output manifold 400 has a condensateoutlet 440 to which the first end 132 of condensate conduit 130 isconnected.

Input manifold 300 and output manifold 400 are preferably made of athermal-insulating material. The materials described above for housing50 of evaporator 10 can be used for making Input manifold 300 and outputmanifold 400. In one exemplary embodiment, LE grade Garolite sheet fromMcMaster Carr, Atlanta, Ga. is used. This material is composed ofseveral layers of fine weave cotton fabric that is compressed, heatedand cured in phenolic resin.

FIGS. 16 thru 17 show condenser core 220 a of condenser 200 a of afurther embodiment of the present invention, which has a differentcondensation chamber structure and interface between adjacent blades.Condenser 200 a can have the same input manifold 300 and output manifold400 described above. FIG. 16 shows a top view of condenser core 220 a.In this embodiment, blade 230 a is planar, and condensation chamber 550is formed by placing a spacer ring 580 around a radially extendedmulti-slot aperture 560. As shown in FIG. 16A, spacer ring 580 has aheight 582, which separates two adjacent blades 230 a. The condensercore 220 a is formed with a plurality of blades 230 a stacking one ontop another along the longitudinal axis 212 a, with spacer rings 580in-between each two adjacent blades 230 a, as shown in FIG. 17.

Spacer ring 580 can be attached to blade 230 a by soldering, or by othersuitable means. In one embodiment, spacer ring 580 is made of stainlesssteel, which is a poor heat conductive material in comparison to copper.Therefore, the heat transfer by conduction between adjacent blades,other than by vapor, is reduced. This further enhances the temperaturedifference between the top of condenser core 220 a where the vaporenters, and the bottom of condenser core 220 a where the condensateexits the condenser. Consequently, the condensate produced has a lowtemperature, which is not prematurely heated within the condenser byconductive heat transfer between the blades through the space rings.

As shown in the enlarged view of FIG. 16B, multi-slot aperture 560 hasmultiple slots 564 extending radially from a center aperture 562. Inthis configuration, there are no separate orifice and semisphericalaperture as described above. Instead, the radially extended multi-slotaperture 560 provides the passages for both vapor and the condensate,and functions as a multi-frequency resonator, as further describedbelow. In condensation chamber 550, the condensate flows down throughthe ends of slots 564 near spacer ring 580, while the vapor passesthrough center aperture 562 and the ends of slots 564 near centeraperture 562.

As shown, multiple slots 564 have different lengths, for example, thepair of opposing slots 564 a is the longest and the pair of opposingslots 564 b is the shortest. This forms multiple different reeds.Because of the length difference in the slots, one reed 568 formedbetween two adjacent slots can have a different triggering threshold forvibration or resonance in the pressurized vapor from the triggeringthresholds of other reeds. Some reeds start to vibrate at a lower vaporpressure, and others start to vibrate at a higher vapor pressure. Withthis configuration, the vibration can be induced even under a relativelylow vapor pressure, such as under a condition where the heat generatingdevice has not reached very high temperature. This mechanism broadensthe effective operating range for initiating vibration, which, in turn,enhances the efficiency of the condenser when the heat generating devicehas yet reached an undesirable high temperature.

It should be understood that other suitable structures or configurationsof the condensation chamber and the apertures on the blades, whichenable vibration in the presence of the vapor flow, can also be used forthe purpose of the present invention.

The operation mechanisms of the phase-separated evaporator and theblade-thru condenser have been individually described above. Theoperation of the heat dissipation system 100 of the present invention isbriefly described below from the perspective of the whole system.

Vacuum is applied to heat dissipation system 100 to remove air, then apredetermined amount of a coolant is placed into the phase-separatedevaporator 10 under vacuum, and the system is sealed. It is noted thatall connections between the evaporator and the conduits, and between thecondenser and the conduits are air and liquid tight. In operation, whenthe refrigerants described above are used, they evaporate at atemperature about 30° C., and the vapor pressure in evaporator 10 can befrom about 10 psi to about 25 psi.

In general, the bottom surface 24 of boiler plate 20 is placed in directcontact with a contact surface of a heating generating device, forexample, attached to the die face of a CPU of a computer's motherboardfor dissipating heat generated at the CPU. In operation, as the heat istransferred conductively from the CPU, or other heat generating devices,to boiler plate 20, nucleated boiling occurs on top of the micro porousupper surface 22 and pins 30. The coolant absorbs heat, evaporates, andexits from the vapor directing compartment 6. The vapor travels throughvapor conduit 120, enters input manifold 300, and then enters phaseexchange columns 280 of condenser core 220. As described above, the hightemperature and high pressure vapor passes through apertures ofcondensation chambers 250, travels down in phase exchange columns 280.Upon contacting with the blades, the vapor releases heat and convertsback into liquid condensate within phase exchange columns 280. In thisprocess, the vapor passes through the apertures and causes vibration ofthe floor, which further increases the heat exchange efficiency asdescribed above. The condensate formed exits from output manifold 400,flows through condensate conduit 130, and then enters liquid port 58 ofcondensate directing compartment 8 of phase-separated evaporator 10. Thecondensate fills into the plurality of feeding injectors 90, anddispenses onto the landing zones 28. The condensate diffuses on thenucleated boiling surface of the boiler plate, which is then heated upagain by the heat absorbed from the CPU, and is converted into vaporagain.

As such, the evaporation and condensation processes continuerepetitively within heat dissipation system 100, and the phase changefrom the liquid form to the gas form and from the gas form back to theliquid form effectively removes heat from the CPU, or other heatgenerating devices, to a surrounding environment.

Using two separate conduits in heat dissipation system 100 substantiallyreduces heat exchange between the vapor and the condensate during theirtraveling between the evaporator and the condenser. As the vapor leavesthe evaporator, it enters vapor conduit 120 without physical contactwith the returning condensate; therefore, the vapor remains at its hightemperature and effectively carries heat into the condenser. On theother hand, as the condensate exits the condenser, it does not contactthe rising vapor; therefore, the condensate remains at its lowtemperature when it returns back into the evaporator. Moreover,preferably, both vapor conduit 120 and condensate conduit 130 arethermally insulated from the ambient environment. Thermal insulationreduces heat exchange between the vapor inside the vapor conduit and theenvironment, and therefore, maximizes the heat carried by the vapor intothe condenser. Similarly, thermal insulation also reduces heat exchangebetween the condensate and the environment, which minimizes prematureheating of condensate by the environment and maintains the condensate ata low temperature as it enters the evaporator.

An unprecedented heat dissipation efficiency has been observed using theinstant heat dissipation system. As illustrated in the example below,using the heat dissipation system of the present invention, thetemperature of a simulated die face of CPU was maintained below 55° C.with an input power of 330 W for simulating heat generation. Incomparison, when an existing commercial ThermalRight XP90C 4-tube heatpipe was used as the heat dissipation device, the temperature of thesame die face was already about 60° C. when the input power was only 170W.

As further shown in FIGS. 19A and 20A, when expressed with the heatresistance θcs (C/W), using the instant heat dissipation system the heatresistance of the simulated die face of CPU was about 0.08 (C/W) whenthe input power was about 330 W, while using ThermalRight XP90C, theheat resistance of the simulated die face of CPU was about 0.22 (C/W)when the input power was about 170 W. It is noted that the lower theheat resistance of the die face of the CPU, the more effective the heatdissipation device is.

Currently, the lowest heat resistance achieved by the existing heatdissipation devices known in the art is about 0.12 (C/W). Therefore, theheat dissipation system of the present invention has made arevolutionary breakthrough in terms of efficiency and capacity in heatdissipation.

EXAMPLE

A prototype heat dissipation system was built, which included aphase-separated evaporator, illustratively shown in FIG. 11, ablade-thru condenser comprising condenser core 220 a (as illustrated inFIGS. 16-17), a condensate conduit, and a vapor conduit.

In the phase-separated evaporator, the boiler plate had a square shapewith a dimension of about 40 cm by about 40 cm. The micro porous coatingmaterial coated area is about 30 cm by about 30 cm. The boiler plate hada matrix of 256 pins formed with 16 rows by 16 column pins, with 7 pinsremoved at the locations corresponding to the 7 feeding injectors. Thepins had a square cross section, with a dimension of about 1 mm by 1 mmand a height about 4 mm.

The housing and the partitioner were made of thermal-insulating plasticsthen coated with an epoxy coating to render the surface impermeable tothe refrigerant. The boiler plate was connected to the base of thehousing of the phase-separated evaporator by epoxy adhesive. Thepartitioner had 7 tapered feeding injectors toward the boiler plate,immediately above the landing zones located at the spaces formed by theremoved pins.

In the condenser, the condenser core was constructed with 40 blades ofcopper blank. Each blade had a length about 127 mm, a width about 44.5mm, and a thickness about 0.17 mm. The blades were substantially planar,and the distance between two adjacent blades was about 1.5 mm.

On each blade, three multi-slot apertures as illustrated in FIG. 16Bwere produced using wire EDM. Each slot had a width about 0.25 mm. Thepair of longest slots (546 a) had a total length of about 18 mm, and thepair of shortest slots (546 b) had a total length of about 8 mm. Twopositioning apertures (569) were provided for each multi-slot aperturefor alignment of the spacer ring.

The spacer rings were made of plastics, which had an oblong shape, witha width of about 17 mm, a length of about 25 mm and a height of about1.5 mm. On the lower side of the spacer ring, there were two positionalbumps (not shown, about 0.5 mm in height) complementary to the twopositioning apertures (569) on the blade. On the upper side of thespacer ring, there were two positional dimples (567, about 0.5 mm indepth) complementary to the two positional bumps on the lower side ofthe spacer rings. Two spacer rings, above and below one blade, werealigned by inserting the positioning bumps through the positioningapertures into the positioning dimples underneath the blade. Each spacerring was attached to the blade by epoxy adhesive to form an air andliquid tight connection. As such, three spacer rings were positionedaround the multi-slot apertures between every two adjacent blades, andthe process was repeated to form the condenser core.

The input manifold and output manifold were in a form of rectangularcase, hermetically sealed to the condenser core by epoxy adhesive. Theinput manifold and output manifold were made of thermal-insulatingplastics and coated with epoxy.

Vacuum is applied to the hermetically sealed system through a sealableopening on the condensate conduit, such as a valve, then about 65 ml ofGenetron® refrigerant 245FA from Honeywell was added into the evaporatorthrough the condensate conduit.

Heat dissipation efficiency of the heat dissipation system describedabove was tested in comparison to a commercial ThermalRight XP90C 4-tubeheat pipe. The test used a variable AC transformer (Variac) to apply anAC voltage to a heater cartridge, which was in direct contact with thebottom surface of the boiler plate. A current sense resistor allowed thecurrent to be measured with a voltmeter to avoid circuit path errors.Both voltage measurements were performed with true RMS voltmeters. Thefan was powered by a precise 12.00V. The ambient air and the simulateddie face temperature were measured with thermocouples. The test powercircuit is illustrated in FIG. 18.

The test results using two different fan speeds (100 CFM and 79 CFM) areshown in FIGS. 19A thru 20B. FIGS. 19B and 20B show the curves of inputpower to the heater cartridge vs. the temperature of the simulated dieface of a CPU. As shown in FIG. 19B, with the fan speed of 100 CFM, whenThermalRight XP90C was used as the heat dissipation device, thetemperature of the simulated die face reached about 60° C. when theinput wattage was 170 W. However, as shown in FIG. 20B when the instantheat dissipation system described above was used, the temperature of thesimulated die face was maintained below 55° C., when the input wattageto the heater cartridge was about 330 W, which was nearly double of 170W.

FIGS. 19A and 20A show the curves of heat resistance (θcs) of thesimulated die face of CPU vs. input power to the heater cartridge. Asshown in FIG. 19A, when ThermalRight XP90C was used, with the fan speedof 100 CFM, the heat resistance θcs of the simulated die face of CPU wasabout 0.22 (C/W) when the input power was about 170 W. As shown in FIG.20A, when the instant heat dissipation system described above was used,with the same fan speed, the heat resistance of the simulated die faceof CPU was about 0.08 (C/W) when the input power was about 330 W.

The invention has been described with reference to particularlypreferred embodiments. It will be appreciated, however, that variouschanges can be made without departing from the spirit of the invention,and such changes are intended to fall within the scope of the appendedclaims. While the present invention has been described in detail andpictorially shown in the accompanying drawings, these should not beconstrued as limitations on the scope of the present invention, butrather as an exemplification of preferred embodiments thereof. It willbe apparent, however, that various modifications and changes can be madewithin the spirit and the scope of this invention as described in theabove specification and defined in the appended claims and their legalequivalents. All patents and other publications cited herein areexpressly incorporated by reference.

1. A phase-separated evaporator comprising: (a) a boiler plate; and (b)a phase separation chamber comprising: (i) a housing having a baseconnected to said boiler plate; said housing having a liquid port and agas port; and (ii) a phase partitioner inside said housing, dividingsaid phase-separated evaporator into a vapor directing compartment on aside of said boiler plate and a condensate directing compartment on anopposing side of said phase partitioner; said vapor directingcompartment being in communication with said gas port and saidcondensate directing compartment being in communication with said liquidport; said phase partitioner including a plurality of openingspermitting a condensate in said condensate directing compartment to passtherethrough to said vapor directing compartment.
 2. The phase-separatedevaporator of claim 1, wherein said phase partitioner includes apartition panel and said openings include a plurality of feedinginjectors extending from a surface of said partition panel within saidvapor directing compartment toward an upper surface of said boilerplate.
 3. The phase-separated evaporator of claim 2, wherein each ofsaid feeding injectors has an injector inlet and an opposing injectortip; and said injector tip is disposed immediately adjacent said uppersurface of said boiler plate.
 4. The phase-separated evaporator of claim2, wherein said partition panel has a pressure vent opening forbalancing pressure between said condensate directing compartment andsaid vapor directing compartment.
 5. The phase-separated evaporator ofclaim 2, wherein said liquid port and said gas port are positioned on aside wall of said housing; and said liquid port is disposed between atop wall of said housing and said partition panel, and said gas port isdisposed between said partition panel and said boiler plate.
 6. Thephase-separated evaporator of claim 1, wherein a top wall of saidhousing and said partition panel incline along a longitudinal axis ofsaid phase separation chamber toward said boiler plate; and saidpartition panel is substantially in parallel with said top wall.
 7. Thephase-separated evaporator of claim 3, wherein said upper surface ofsaid boiler plate is coated with a micro porous coating material.
 8. Thephase-separated evaporator of claim 7, wherein said upper surface ofsaid boiler plate comprises a plurality of pins extending upwardtherefrom.
 9. The phase-separated evaporator of claim 7, wherein saidboiler plate comprises a plurality of landing zones on said uppersurface in spaces among said pins, surfaces of said landing zones beingsubstantially free of said micro porous coating material; and saidinjector tips are disposed immediately adjacent said landing zones. 10.The phase-separated evaporator of claim 1, wherein said phasepartitioner and said housing are made of a thermal-insulating material.11. The phase-separated evaporator of claim 1, wherein a top wall ofsaid housing has an inclined section covering substantially an uppersurface of said boiler plate along a longitudinal axis of said phaseseparation chamber, and a port section adjacent to, and verticallyextending above, said inclined section; and said liquid port and saidgas port are positioned on top of said port section.
 12. Thephase-separated evaporator of claim 11, wherein said partition panelincludes an inclined panel substantially in parallel with said inclinedsection of said top wall of said housing and a vertical sectionextending from one end of said inclined panel upwardly within said portsection; and said inclined panel comprises a plurality of feedinginjectors extending therefrom toward said boiler plate.
 13. A heatdissipation system comprising: (a) a phase-separated evaporator,comprising: (i) a boiler plate; and (ii) a phase partitioner inside saidhousing, dividing said phase-separated evaporator into a vapor directingcompartment on a side of said boiler plate and a condensate directingcompartment on an opposing side of said phase partitioner; said vapordirecting compartment being in communication with said gas port and saidcondensate directing compartment being in communication with said liquidport; said phase partitioner including a plurality of openingspermitting a condensate in said condensate directing compartment to passtherethrough to said vapor directing compartment; (b) a condenser; (c) avapor conduit connected between said gas port of said evaporator and aninput interface of said condenser; and (d) a condensate conduitconnected between an output interface of said condenser and said liquidport of said evaporator.
 14. The heat dissipation system of claim 13further comprising a fan positioned adjacent to said condenser, forremoving hot air released from said condenser.
 15. The heat dissipationsystem of claim 13, wherein said condenser is a blade-thru condensercomprising: (a) a condenser core comprising multiple substantiallyplanar blades, each of said multiple blades having at least one chamberformed monolithically therein, a floor of said chamber having at leastone aperture; said multiple blades joined in parallel alignment, withsaid apertures positioned to permit vapor and condensate to pass throughsaid apertures; (b) an input interface; and (c) an output interface. 16.The heat dissipation system of claim 15, wherein said apertures includeat least one reed.
 17. The heat dissipation system of claim 13, whereinsaid condenser is a blade-thru condenser comprising: (a) a condensercore comprising multiple substantially planar blades joined in parallelby one or more spacer rings disposed between two adjacent blades; eachof said blades comprising one or more chambers formed within interiorsof said spacer rings, wherein an area of said blades enclosed withinsaid spacer ring forms a floor of said chamber and said spacer ringforms a wall of said chamber, said floor having at least one aperture;said chambers of said multiple blades in alignment to permit vapor andcondensate to pass through said apertures; (b) an input interface; and(c) an output interface.
 18. The heat dissipation system of claim 17,wherein said floor of said chamber and rest of said blades aremonolithic.
 19. A computer system comprising a heat dissipation systemcomprising a phase-separated evaporator, a condenser, and a coolanthermetically sealed therein; said phase-separated evaporator comprising:(a) a boiler plate being in a direct contact with a heat generatingcomponent of said computer system; and (b) a phase separation chambercomprising a housing and a phase partitioner; said housing having a baseconnected to said boiler plate and having a liquid port and a gas port;and said phase partitioner inside said housing, dividing saidphase-separated evaporator into a vapor directing compartment on a sideof said boiler plate and a condensate directing compartment on anopposing side of said phase partitioner; said vapor directingcompartment being in communication with said gas port and saidcondensate directing compartment being in communication with said liquidport; said phase partitioner including a plurality of openingspermitting a condensate in said condensate directing compartment to passtherethrough to said vapor directing compartment.
 20. The computersystem of claim 19, wherein said condenser comprises a condenser corecomprising multiple substantially planar blades, each of said multipleblades having at least one chamber formed monolithically therein, afloor of said chamber having at least one aperture; said multiple bladesjointed in parallel alignment, with said apertures positioned to permitvapor and condensate to pass through said apertures.